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  • MBE_PW2014
    Brolis records profitable 2017, expects to double revenues in 2018.

    February 2, 2018. Vilnius, Lithuania. Brolis Semiconductors posted a profitable year in 2017 with revenues of 6.5 M EUR and expects to double the revenues in 2018, exceeding 12 M EUR. Company operates across three European locations with headquarters in Vilnius, Lithuania, electro-optic system sales & assembly site in Larne, Northern Ireland and a recently incorporated […]

    February 2, 2018. Vilnius, Lithuania. Brolis Semiconductors posted a profitable year in 2017 with revenues of 6.5 M EUR and expects to double the revenues in 2018, exceeding 12 M EUR. Company operates across three European locations with headquarters in Vilnius, Lithuania, electro-optic system sales & assembly site in Larne, Northern Ireland and a recently incorporated integrated photonics R&D site in Ghent, Belgium.

    “Brolis technology has been expanding both vertically and horizontally over the last few years and 2017 marks the first results of our strategic decisions made in the previous years. Having all the technology in-house, allows us to work in very different markets, such as defence, medical and research. I see Brolis as a very efficient company – we have a small but elite engineering team, generating over 350 kEUR/employee, which is self-explanatory. At the same time, we are heavily investing into research & development allocating around 60% of operating expenses there which is definitely not usual in the industry. Brolis is involved into very deep developments of extremely innovative technology based on hybrid integration of our proprietary III-V light sources with photonic integrated circuits based on Si. The new technology is aligned to be compatible with standard CMOS IC fabrication processes opening new opportunities for consumer market, firstly in the field of healthcare wearables. Our team is also very active in creating new IP, filing 3 patent applications in the last year” – says, Dominykas Vizbaras, CEO of Brolis.

  • DSC_0494
    Brolis defence products featured on National Television

    November 18, 2017. Brolis semiconductors defence products were featured on “Military Secrets” shown on National Television LRT. Program featured Brolis advanced thermal sight LW75, SWIR sniper system S250U, assault laser pointer/illuminator LP3X and Gen4 night vision monocular BPS14 – all in active use by Lithuanian Armed Forces and LITHSOF. For a full video, please use the […]

    November 18, 2017. Brolis semiconductors defence products were featured on “Military Secrets” shown on National Television LRT. Program featured Brolis advanced thermal sight LW75, SWIR sniper system S250U, assault laser pointer/illuminator LP3X and Gen4 night vision monocular BPS14 – all in active use by Lithuanian Armed Forces and LITHSOF.

    For a full video, please use the direct link here: video

  • 20171005_083821_v1
    Brolis starts a new R&D division for silicon photonics in Belgium

    Brolis Semiconductors to open a new R&D division for silicon photonics in Ghent, Belgium.   October 10th , 2017. Ghent, Belgium / Vilnius, Lithuania.  UAB Brolis Semiconductors is proud to announce the incorporation of a new R&D division – Brolis Semiconductors BVBA in Ghent, Belgium. The Belgian entity will focus on the design and development […]

    Brolis Semiconductors to open a new R&D division for silicon photonics in Ghent, Belgium.

     

    October 10th , 2017. Ghent, Belgium / Vilnius, Lithuania.  UAB Brolis Semiconductors is proud to announce the incorporation of a new R&D division – Brolis Semiconductors BVBA in Ghent, Belgium. The Belgian entity will focus on the design and development of novel cutting-edge integrated photonic systems, combining Brolis proprietary III-V technology of long-wave infrared light sources and CMOS compatible photonic integrated circuit technology. CMOS technology is the most widely used and most developed technology for producing today’s integrated circuits used in every electronic device at very large volumes resulting in low cost/chip and widespread abundance.  Special emphasis is directed towards development of a new OEM GaSb/Silicon-on-insulator system-on-a-chip laser sensor technology for sensing applications in the 1.5 – 3.5 micron spectral range and beyond for healthcare and industrial markets.

    “Brolis is delighted to add photonic integrated circuit technology to the existing technology portfolio – we believe it provides a new dimension to our existing III-V semiconductor technology. The addition of silicon technology to GaSb is expected to pave the way to an integrated hybrid chip technology with completely new functionality – such as OEM remote laser sensors for industrial and healthcare applications with a footprint of few mm2, which could enter any handheld, wearable device platform offering features not available today. We are particularly happy to land in Ghent – a world famous location for silicon photonics technology research. Successful cooperation with the Photonics Research Group provided a decisive push towards making directional efforts in commercialization of GaSb/SOI technology. We feel like we’re in good company in Ghent says Augustinas Vizbaras, co-founder and Head of Chip Technology at Brolis Semiconductors.

    “Over the years Brolis has managed to bring GaSb-based laser diode technology to an industrial level with beyond state-of-the art device performance and scale. The next big step is to merge these GaSb chips as key components with photonic integrated circuit technology based on CMOS compatible silicon-on-insulator technology. Moreover, we should bring it to an industrial level, suitable for consumer market applications”, says Dr. Andreas De Groote, who is to lead the design effort of the photonic integrated circuit technology at the new location.

    “While silicon photonics has predominantly been studied for optical transceivers, there are fantastic opportunities in the field of sensing as well. We believe the combination of GaSb III-V opto-electronics and silicon photonics can enable many applications in this domain.” says Prof. Gunther Roelkens from the Photonics Research Group at UGent – imec.

    Thomas Castrel, economic counsellor at the Vilnius office of Flanders Investment & Trade, the export and investment promoting agency of the Flemish government (Belgium), welcomes the opening of an R&D unit of Brolis Semiconductors in the Flemish city of Ghent: “this investment testifies of the strong reputation of Flanders in photonics R&D. Companies are choosing the Flemish region for R&D activities because of the presence of world class universities and research institutes combined with a friendly fiscal environment for research driven businesses. We are very happy that Brolis Semiconductors, a flagship company of Lithuania, has been developing fruitful cooperation with the university in Ghent for many years and that this is now resulting in a new office in Flanders.”

     

    For more information, contact Augustinas Vizbaras, augustinas.vizbaras_at_ brolis-semicon.com

Upcomming Events

  • SPIEDSS2018
    SPIE Defense+Commercial Sensing 2018, Orlando, USA

    April 15-18, 2018, Orlando, USA. SPIE Defense + Commercial Sensing Hear leading researchers speak about sensors, infrared technology, laser systems, spectral imaging, radar, LIDAR, and more. Come learn about the latest technical advancements, find new business opportunities, and collaborate with other experts working on defense and commercial applications. Brolis Semiconductors will provide a talk on […]

    April 15-18, 2018, Orlando, USA.

    SPIE Defense + Commercial Sensing
    Hear leading researchers speak about sensors, infrared technology, laser systems, spectral imaging, radar, LIDAR, and more. Come learn about the latest technical advancements, find new business opportunities, and collaborate with other experts working on defense and commercial applications.

    Brolis Semiconductors will provide a talk on the latest developments of next-generation Band-I DIRCM lasers:Session 3:
    Laser Diode Source Development I

    Tuesday 17 April 2018
    1:40 PM – 3:20 PM

    Session Chair:

    Christopher Ebert, Coherent, Inc. (United States)
    Band I DIRCM laser based on GaSb direct diode technology
    Paper 10637-10
    Author(s): Edgaras Dvinelis, Greta Naujokaite, Mindaugas Greibus, Donatas Buivydas, Augustinas Trinkunas, Kristijonas Vizbaras, Augustinas Vizbaras, Brolis Semiconductors UAB (Lithuania)

    Hide Abstract
    MANPADS are responsible for over 60% of total aircraft casualties since 1960’s. DIRCM systems have been deployed in order to counter the threat. DIRCM system requires sources operating in bands I, II and IV. Recent development of GaSb laser diode technology at Brolis Semiconductors greatly improved performance parameters of laser diodes working in 1900-2450 nm range (band I). In this work we present a laser diode module operating in 2.1-2.3 µm spectral band and capable of providing directional beam with radiant intensity value of more than 30 kW/str. Module is extremely compact, lightweight (<50 g) and efficient (15%).
  • PIC International 2018 Logo BLU WHT
    PIC/CS/HES International Conference 2018, Brussels, Belgium

    April 10-11, Brussels, Belgium. Brolis Semiconductors is proudly sponsoring three co-located high-level conferences on photonic integrated circuits, compoiund semiconductors and high-end sensors. The event is co-locating:   PIC-International: 3rd PIC International 2018 will provide timely, comprehensive coverage of every important sector within the photonics integrated circuits industry. Sales of PICs are soaring, with their deployment helping to […]

    April 10-11, Brussels, Belgium. Brolis Semiconductors is proudly sponsoring three co-located high-level conferences on photonic integrated circuits, compoiund semiconductors and high-end sensors.

    The event is co-locating:

     

    PIC-International: 3rd PIC International 2018 will provide timely, comprehensive coverage of every important sector within the photonics integrated circuits industry.

    Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by organising the 3rd PIC International, a global conference dedicated to this industry.

    Attendees at the 3rd PIC International conference will hear industry-leading insiders deliver more than 30 presentations spanning five sectors. This will equip the delegates at this two-day conference with an up-to-date overview of the status of the PIC industry, and provide them with many opportunities to meet other key players within this community.

    More information: PIC

     

    CS-International: 8th CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors.

    Several great speakers have already accepted the invitation to speak at CS International 2018, the must-attend event for the compound semiconductor industry. Presentations secured for this conference include: a trio of talks on GaN power electronics, given by leaders at Transphorm, Panasonic and VisIC; presentations on the integration of compound semiconductor and silicon technologies by NAsP III-V and the co-ordinators of two multi-partner European projects; and a talk by Seoul Semiconductor on its pioneering efforts at chip-scale LEDs. All presentations fit into one of five themes, each of which includes a talk by a leading market analyst.

    Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

    Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

    More information: CS

    HES-International: 1st High-End-Sensors International Conference

     High-end sensor devices are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer operational lifetimes. We will examine new technologies that are cutting costs while increasing effectiveness. We will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency.

    More information: HES

  • atsisiųsti
    SPIE Photonics West 2018, San Francisco, USA.

    January 30 – February 1, 2018. San Francisco, USA. Brolis Semiconductors will be exhibiting at the world’s largest photonics exhibition – SPIE Photonics West 2018! We encourage you to visit us at our booth #5359, North Hall D to get the latest update on our products, technology capabilities and newest developments. Brolis will also feature two […]

    January 30 – February 1, 2018. San Francisco, USA.

    Brolis Semiconductors will be exhibiting at the world’s largest photonics exhibition – SPIE Photonics West 2018! We encourage you to visit us at our booth #5359, North Hall D to get the latest update on our products, technology capabilities and newest developments.

    Brolis will also feature two technical talks on the latest developments in the field of defense and integrated photonics:

    Our latest proprietary technology for advanced DIRCM protection in Band-I will be overviewed in the LASE conference on Monday, Jan 29:

    Next generation DIRCM for 2.1-2.3 micron wavelength based on direct-diode GaSb technology
    Paper 10514-4
    Author(s): Edgaras Dvinelis, Greta Naujokaite, Mindaugas Greibus, Augustinas Trinkūnas, Kristijonas Vizbaras, Augustinas Vizbaras, Brolis Semiconductors UAB (Lithuania)

    Hide Abstract
    Continuous advances in low-cost MANPAD heat-seeking missile technology over the past 50 years remains the number one hostile threat to airborne platforms globally responsible for over 60 % of casualties. Laser based directional countermeasure (DIRCM) technology have been deployed to counter the threat. Ideally, a laser based DIRCM system must involve a number of lasers emitting at different spectral bands mimicking the spectral signature of the airborne platform. Up to now, near and mid infrared spectral bands have been covered with semiconductor laser technology and only SWIR band remained with bulky fiber laser technology.
    A second talk will feature latest work on long-wave integrated photonics and sensing technology in the OPTO conference:
    III-V/silicon photonic integrated circuits for spectroscopic sensing in the 2um wavelength range
    more update coming soon!

Contacts

Locations:

UAB Brolis Semiconductors (HQ)

 

Brolis Semiconductors BVBA (R&D)

 

Brolis Photonics Solutions ( E-O systems)

  • Willowbank Business Park
  • Larne, County Antrim BT40 2SF
  • Northern Ireland, United Kingdom
  • web: www.b-photonics.com
 

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