PIC/CS/HES International Conference 2018, Brussels, Belgium

April 10-11, Brussels, Belgium. Brolis Semiconductors is proudly sponsoring three co-located high-level conferences on photonic integrated circuits, compoiund semiconductors and high-end sensors.

The event is co-locating:

 

PIC-International: 3rd PIC International 2018 will provide timely, comprehensive coverage of every important sector within the photonics integrated circuits industry.

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by organising the 3rd PIC International, a global conference dedicated to this industry.

Attendees at the 3rd PIC International conference will hear industry-leading insiders deliver more than 30 presentations spanning five sectors. This will equip the delegates at this two-day conference with an up-to-date overview of the status of the PIC industry, and provide them with many opportunities to meet other key players within this community.

More information: PIC

 

CS-International: 8th CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors.

Several great speakers have already accepted the invitation to speak at CS International 2018, the must-attend event for the compound semiconductor industry. Presentations secured for this conference include: a trio of talks on GaN power electronics, given by leaders at Transphorm, Panasonic and VisIC; presentations on the integration of compound semiconductor and silicon technologies by NAsP III-V and the co-ordinators of two multi-partner European projects; and a talk by Seoul Semiconductor on its pioneering efforts at chip-scale LEDs. All presentations fit into one of five themes, each of which includes a talk by a leading market analyst.

Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

More information: CS

HES-International: 1st High-End-Sensors International Conference

 High-end sensor devices are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer operational lifetimes. We will examine new technologies that are cutting costs while increasing effectiveness. We will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency.

More information: HES