SPIE Photonics West 2018, San Francisco, USA.

January 30 – February 1, 2018. San Francisco, USA.

Brolis Semiconductors will be exhibiting at the world’s largest photonics exhibition – SPIE Photonics West 2018! We encourage you to visit us at our booth #5359, North Hall D to get the latest update on our products, technology capabilities and newest developments.

Brolis will also feature two technical talks on the latest developments in the field of defense and integrated photonics:

Our latest proprietary technology for advanced DIRCM protection in Band-I will be overviewed in the LASE conference on Monday, Jan 29:

Next generation DIRCM for 2.1-2.3 micron wavelength based on direct-diode GaSb technology
Paper 10514-4
Author(s): Edgaras Dvinelis, Greta Naujokaite, Mindaugas Greibus, Augustinas Trinkūnas, Kristijonas Vizbaras, Augustinas Vizbaras, Brolis Semiconductors UAB (Lithuania)

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Continuous advances in low-cost MANPAD heat-seeking missile technology over the past 50 years remains the number one hostile threat to airborne platforms globally responsible for over 60 % of casualties. Laser based directional countermeasure (DIRCM) technology have been deployed to counter the threat. Ideally, a laser based DIRCM system must involve a number of lasers emitting at different spectral bands mimicking the spectral signature of the airborne platform. Up to now, near and mid infrared spectral bands have been covered with semiconductor laser technology and only SWIR band remained with bulky fiber laser technology.
A second talk will feature latest work on long-wave integrated photonics and sensing technology in the OPTO conference:
III-V/silicon photonic integrated circuits for spectroscopic sensing in the 2um wavelength range
more update coming soon!